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Dongguan Ziitek Electronical Material and Technology Ltd.
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Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules

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Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules

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Brand Name : Ziitek

Model Number : TIF180-02F Series

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules

Density : 2.3 g/cm³

Flame rating : 94 V0

Thermal conductivity : 1.5W/m-K

Keywords : Thermal Gap Pad

Features : Good softness and fillability

Hardness(Shore OO) : 60

Application : Memory Modules

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Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules

Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Products description

The TIF180-02F Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features

> Good thermal conductive: 1.5W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Easy release construction
> Electrically isolating
> High durability

Applications

> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices

> Motherboard chip
> Radiator
> AI Processors AI Servers

Typical Properties of TIF®100-02F Series
Property Value Test method
Color Gray White Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 60 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.5W/m-K ASTM D5470
1.5W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


TheTIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Product Tags:

Memory Modules Thermal Gap Pad

      

UL Thermal Gap Filler Pad

      

94 V0 Thermal Gap Pad

      
Quality Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules for sale

Good Thermal Conductive Thermal Gap Pad UL Recognized For Memory Modules Images

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